CAP COVER CGP 80X120 ESD

***Disclaimer: The following summary contains information gathered from various sources such as product descriptions, technical specifications and catalogs. While efforts have been made to provide accurate details, inaccuracies may occur. It is advised to verify all information by contacting Bosch Rexroth directly.***
The Bosch Rexroth CAP COVER CGP 80X120 ESD (3842558496) is an essential component designed for closing profile joints and profile butt joints in a variety of application combinations. This particular cover cap is compatible with strut profile systems, ensuring a secure fit and finish for structural connections. The product is specifically crafted to work with profile joint or in conjunction with strut profiles, providing versatility in its use. Manufactured from high-quality polypropylene (PP), the cover cap boasts durability and resilience, making it suitable for long-term use in various environments. The black ESD (Electrostatic Discharge) version of the cap is particularly significant for applications where static discharge could pose a risk to sensitive electronic components or equipment. This feature helps to mitigate the potential buildup of static electricity, protecting both the structural integrity of the system and any electronics that may be affected by electrostatic phenomena. The dimensions of the CAP COVER CGP 80X120 ESD are tailored to ensure a perfect fit with the specified profiles, maintaining a clean and professional appearance once installed. The product's weight has been optimized to contribute minimally to the overall mass of the assembly, while still providing robust protection and coverage. As part of Bosch Rexroth's product group ID range, this cover cap comes packaged in units designed for efficient handling and inventory management. Its inclusion as an ESD-safe component makes it an indispensable item for industries where electronic safety is paramount. The CAP COVER CGP 80X120 ESD combines practical functionality with protective features, making it an excellent choice for enhancing both the structural and electronic integrity of various systems.